Huawei’s upcoming flagship chip HiSilicon Kirin 980 has been rumored since a long time ago. Previously, the company has officially sent press invites for an IFA 2018 event, where the next gen. Kirin 980 might be revealed. Taking it to further, we have found some benchmarking screenshots, obtained by Chinese News Portal, reveal the hidden specs of the anticipated SoC.
HiSilicon Kirin 980 Expected Specifications
As some recent media reports suggest, the Kirin 980 will be built on TSMC’s highly power efficient 7nm architecture. It will have octa-core CPU clocked at up to 2.8 GHz for higher 4 x Cortex-A77 cores, whereas, lower 4 x Cortex A55 cores freq. is still unspecified. The Kirin 980 will be paired with powerful Mali-G72 MP24, 24 cores Graphics Processing Unit with refined graphics capabilities.
The screenshot suggests its arrival in Q3, 2018, which goes perfectly fine as the company is holding an event for August 31 at IFA 2018. Further, it will support LPDDR 4X RAM, which is obvious for a flagship-grade chip, even most of the mid-range chips are supporting. It also carries a second gen. NPU following its predecessor, triple ISP for faster image processing and LTE modem with Cat.19 to deliver up to 1.6 Gbps download speed. Definitely, onboard specs are pretty impressive if the taken screenshots are believed and should deliver a smoother experience.
Attention: Above mentioned screenshots could be unreliable as Cortex A77 isn’t announced yet. Arguably, some industry experts believe that either Kirin 980 will arrive with Cortex A76 or ARM could make some announcements at IFA event.
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