The HiSilicon Kirin 970 has already been part of several leaks and rumors. To recall, it is the successor of Kirin 960 and recently we got to know that mass production has been started to fabricate the SoC. Today, we have got some leaked specification in the form of a screenshot.
As you can see in the screenshot, Kirin 970 CPU applies 8-core (4 x Cortex-A73 +4 x Cortex-A53)64-bit architecture, the highest frequency of 2.8GHz, using TSMC’s 10nm process technology with adaptive LPDDR4 memory at max. freq. 1866 MHz. The GPU integration would be Mail-G72 MP8 Baseband support up to LTE Cat.12 protocol. It is worth mentioning that the screenshot points that the chip will be released in the third quarter of 2017.
Most probably Mate 10 would be the first device to get it. The Mate 10 is rumored to feature 6.1-inch 18:9 ratio FHD+ display, 6GB RAM, Android 7.1.1 and Kirin 970 processor.