Huawei Kirin 970 SoC showcased at IFA 2017 with dedicated NPU


Huawei is gradually stepping up in chip fabrication and already produced several SoCs from mid to high range, those are being used on its own devices. Recently, we had reported about Company’s forthcoming flagship grade chipset – the Kirin 970; that will be utilized in most of the Huawei’s high-end smartphones. Rumors suggest that Huawei Mate 10 would be the first smartphone to have it.


Surprisingly, The company has showcased the Kirin 970 at IFA 2017. The new chipset makes several improvements over last year’s Kirin 960. It employs TSMC’s 10nm process whereas, 960 was using the 16nm process. So, we can expect great power efficiency in a smaller package. However, this is not a new thing in the smartphones industry, though, the first time you will see in Huawei smartphones. The integrated CPU is octa core, where 4 x A73 cores are clocked @ 2.3GHz while another 4 x A53 cores are clocked @ 1.8Ghz with given GPU of Mali-G72 MP12.


The rest of the features are dual ISP for motion detection and low light enhancement, support for HDR10 with 4K60 decoding, 4K30 encoding, and an LTE Category 18 modem, which is capable of going up 1.2Gbps for download speed. Besides, the chipset comes along with a dedicated Neural processing unit (NPU), rated at 1.92 TFLOPs of FP16, which is 3x more than Kirin 960’s 0.6 TFLOPs FP16. Overall, It seems a balanced chipset, but will it survive against big fishes of the industry Samsung and Qualcomm? Give your opinions in below comment section!

SoC Kirin 970 Kirin 960 Kirin 950
CPU 4x Cortex-A73 @ 2.4GHz
4x Cortex A53 @ 1.8GHz
4x Cortex-A73 @ 2.4GHz
4x Cortex A53 @ 1.8GHz
4x Cortex-A72 @ 2.3GHZ
4x Cortex-A53 @ 1.8GHz
GPU Mali-G72 MP12 Mali-G71 MP8 @900MHz Mali-T880 MP4 @900MHz
Neural Processing Unit (NPU) Yes No No
Media processing 2160p60 HEVC & H.264 Decode
2160p30 Encode
2160p30 HEVC & H.264 Decode & Encode
2160p60 HEVC Decode
1080p H.264 Decode & Encode
2160p30 HEVC Decode
LTE modem LTE Cat 18 LTE Cat 12 LTE Cat 6
Flash interface UFS 2.1 UFS 2.1 eMMC 5.1
Process TSMC 10nm 16nm FinFET 16nm FinFET



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